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C. Chen, L. Chen, Y. Lin, "Electromigration-induced Bi segregation in eutectic SnBi solder joint", J.
Electron. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. Y. Hung, C. Chen, "Electromigration of Sn-9wt%Zn solder", J. Electron. A.T. Wu, Y.C. Hsieh, "Direct observation and kinetic analysis of grain rotation in anisotropic tin under electromigration", Appl.
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